Scheduled presentations:

• Prediction of temperature-dependent thermo-mechanical properties of PCB conductive layers using convolutional neural network
  M. Shevchuk*, C. Schipfer, P. Fuchs, Q. Tao
• Numerical and analytical evaluation of resin flow during PCB pressing cycles
  C. Schipfer*, J. Zuendel, Q. Tao, M. Gramueller, T. Krivec, P. Fuchs
• Inverse analysis for assessing the thermophysical properties of cork at elevated temperatures
  A. Bicelli*, P. Cantor, M. Arruda, A. Duarte, C. Tiago, F. Branco, J. Trindade
• Advancing Mechanical Metamaterials: A Topology Optimization Approach to Design Excellence
  U. Krishnan*, R. Chowdhury
• Numerical modeling of interface propagation in elastic solids with stress concentrators
  P. Kabanova*, A. Freidin
• Computational Modelling of Triboelectric Nanogenerators Considering Surface Roughness
  M. Sanglap*, C. Kumar, I. Athanasiadis, L. kaczmarczyk, C. Pearce, D. Mulvihill, A. Shvarts