ECCOMAS 2024

Numerical simulation and experimental evaluation for the development of a light electronic enclosure used in automotive industry

  • Costa, Susana (PIEP - Innovation in Polymer Engineering)
  • Bastos, Lourenço (PIEP - Innovation in Polymer Engineering)
  • Rietter, Luciano (PIEP - Innovation in Polymer Engineering)
  • Oliveira, Rui (PIEP - Innovation in Polymer Engineering)
  • Freitas, Ricardo (PIEP - Innovation in Polymer Engineering)
  • Rocha, Agnieszka (PIEP - Innovation in Polymer Engineering)
  • Vale, Bruno (PIEP - Innovation in Polymer Engineering)
  • Ribeiro, Carlos (PIEP - Innovation in Polymer Engineering)
  • Serrão, David (PIEP - Innovation in Polymer Engineering)
  • Silva, Joana (PIEP - Innovation in Polymer Engineering)
  • Gonçalves, Nuno (PIEP - Innovation in Polymer Engineering)
  • Carneiro, Filipa (PIEP - Innovation in Polymer Engineering)
  • Silva, Susana (Bosch Car Multimedia)
  • Portinha, Anibal (Bosch Car Multimedia)
  • Bernardo, Pedro (Bosch Car Multimedia)
  • Dias, Gustavo (University of Minho)

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The automotive sector is currently facing a paradigm shift, characterized by heightened demands in sustainability, emissions reduction, efficiency, and safety. Responding to these concerns is imperative, with the need to accelerate the implementation of production processes with minimized environmental impact and costs. This paper underscores the critical need for developing innovative lightweight solutions within the automotive industry. This entails a comprehensive reevaluation of components through redesign or the adoption of novel materials and advanced manufacturing techniques. The study aims to explore and propose strategies that align with the industry's evolving priorities, facilitating the swift adaptation to stringent standards while concurrently enhancing performance and sustainability across automotive applications. This paper focuses on developing a Lightweight Electronic Enclosure (LEE) achieved by substituting traditional metallic materials with functional polymeric and composite alternatives. The primary objective is to meet stringent product requirements while concurrently reducing weight relative to the established metallic baseline. Three critical functional prerequisites guide the development process: ensuring the enclosure can withstand usage loads, providing an effective thermal path for heat dissipation, and isolating internal electronics from undesirable external influences while shielding adjacent devices from internal emitted radiations. The study outlines the methodology, materials selection, and performance evaluation criteria employed in developing a lightweight yet robust electronic enclosure with enhanced thermal management and electromagnetic compatibility. This study employs an iterative numerical methodology to support the product development process. Using modelling and simulation resources, the approach aims to predict and evaluate the fulfilment of specifications. The simulation involves replicating relevant physics to emulate real-world conditions, enabling the assessment of mechanical strength, thermal dissipation, and electromagnetic protection in the LEE. Following the production of functional prototypes, the product is subjected to a battery of experimental tests aimed at validating the simulation results. The assessments confirm the compliance of the overall product specifications. Significantly, a 33% reduction in weight is achieved, with corresponding expectations of cost and environmental impact reduction.