Towards Cyber-Physical Systems in Metal L-PBF for Part Qualification
Please login to view abstract download link
Recent developments in software stack for 3D printers are opening the opportunity to build applications which directly connect to hardware. By leveraging on software development kits (SDKs) provided by the manufacturers, such developments are valuable building blocks to support cyber-physical systems, or digital twins, of 3D printed components. In this presentation, we will discuss our recent work in software development using the SDK provided by EOS. Important information from the print job, such as the scan strategy, are imported, represented digitally, and linked to our existing digital twin platform, which we will also show. By linking to machine SDKs, applications achieve a stronger connection with the actual printer data, strengthening the cyber-physical link that enable digital twins at scale.
