A thermo-hygro-mechanically coupled material model for paper and paperboard
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Biodegradability, recyclability, and reusability are some of the properties which make paper and paperboard a sustainable material. Even though they are mostly used in the packaging industry, the current environmental crisis could lead to a wider utilization. One important aspect, regarding the material’s physical behavior, is its response to thermo-hygro-mechanical loading. Therefore, a novel material model was developed with the aim of capturing the mechanical behavior of paper and paperboard under the influence of temperature and moisture. The model accounts for the interplay between the elasto-plastic deformation of the material, moisture diffusion, and heat conduction. The decrease in stiffness and strength due to increasing moisture and temperature, alongside temperature expansion, swelling, and shrinking were considered. Furthermore, changes in the temperature and moisture fields due to energy dissipation and drying of the material were taken into account as well. The constitutive framework was derived in a thermodynamically consistent manner and is valid for finite deformations. Conventional experiments, alongside microstructural simulations, were conducted in order to identify the necessary material parameters. The model’s capabilities were showcased on several numerical examples. The application of such a simulation tool could prove very beneficial for the packaging industry, allowing them to improve their manufacturing processes, and make the usage of paper and paperboard more lucrative for others as well.
